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From: | Heinrich Warmers |
Subject: | Re: [Paparazzi-devel] how to reduce the PCB stress for mpu6050 in layout. |
Date: | Tue, 19 Feb 2013 06:10:44 +0100 |
User-agent: | Mozilla/5.0 (Windows; U; Windows NT 5.1; de-DE; rv:1.4) Gecko/20030619 Netscape/7.1 (ax) |
Hi, i pre solder the pads of the PCB and the sensor with only 280C??and a solder station. This prevent that the pads are lost. The last solder i do with hot air. You can make the pads longer outside the sensor. Also the unused pads. Then you can solder it only with a normal solder station (pencil). Regards Heinrich Mr.Ma schrieb:
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